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    188宝金博页面版: AN 353 SMT Board Assembly Process Recommendations

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    内容提示： October 201 1Altera CorporationAN-353-4.0Application Note? 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX words and logos are trademarks of Altera Corporation and registered in the U.S. Patent and Trademark Office and in other countries. All other words and logos identified as trademarks or service marks are the property of their respective holders as described at www.altera.com/common/legal.html. Altera warrants performance of its ...

    文档格式：PDF | 页数：10 | 浏览次数：17 | 上传日期：2015-12-31 23:26:00 | 文档星级：
    October 201 1Altera CorporationAN-353-4.0Application Note© 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX words and logos are trademarks of Altera Corporation and registered in the U.S. Patent and Trademark Office and in other countries. All other words and logos identified as trademarks or service marks are the property of their respective holders as described at www.altera.com/common/legal.html. Altera warrants performance of its semiconductor products to current specifications in accordance with Altera's standard warranty, but reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in writing by Altera. Altera customers are advised to obtain the latest version of device specifications before relying on any published information and before placing orders for products or services.101 Innovation DriveSan Jose, CA 951 34www.altera.comSubscribeISO 9001:2008 RegisteredSMT Board Assembly ProcessRecommendationsThis application note describes the board assembly process used in surface-mount technology (SMT) and focuses on the SMT component-to-board reflow soldering process and rework soldering if you are removing or replacing individual components on already-assembled boards.1The information in this application note is for your reference only.Conventional Tin-Lead and RoHS-Compliant Lead-Free ComponentsAltera® provides both the conventional tin-lead and restriction of hazardous substances (RoHS)-compliant lead-free packages. Table 1 lists the second Level Connections of each package type.1While lead-frame and wire-bond packages can be provided as eutectic or lead-free, currently Altera flip-chip packages are RoHS compliant. We use Exemption #15 for the first Level Connections between the flip-chip die to the substrate (RoHS Exemption #15: Lead in solders to complete a viable electrical connection between the semiconductor die and the carrier within the integrated circuit flip-chip packages). For the remainder of this application note, the term Pb-free is used to refer to the BGA solutions provided with Pb-free package solder balls. This is considered the second Level Connections between the package and the PCBs.The recent directives and legislations by nations around the world have mandated elimination of hazardous substances in the electronics industry. While elimination of many of these substances do not have significant impact on reflow soldering of the electronic component, there is one notable exception—lead. The elimination of lead from solders requires special consideration in soldering of the Pb-free components on to PCBs. This application note outlines the differences and recommends solutions to develop the reflow process for Pb-free and RoHS-compliant devices.Table 1. Second Level ConnectionsPackage TypeWire Bond (Eutectic)Wire Bond (RoHS Compliant or Pb-Free)Flip ChipFlip Chip (RoHS Compliant or Pb-Free)Lead frameSn85Pb1 5Matte Sn——Ball-grid array (BGA)Sn63Pb37 (Balls)SAC305 (Balls)Sn63Pb37 (Balls)SAC305 (Balls)

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