188宝金博页面版

EP 1 758 162 A12510152025303540455055DescriptionTECHNICAL FIELD?[0001] The present invention relates to a sticking ap-paratus and a sticking method, in particular, to a stickingapparatus and a sticking method in which the occurrenceof wrinkles and the mixing of air bubbles can be preventedwhen an adhesive sheet is stuck on a plate-?like membersuch as a semiconductor wafer or the like.BACKGROUND ART?[0002] Conventionally, after separating a semiconduc-tor wafer (hereinafter, simply referred to as "wafer") onwhich a circuit surface is formed into individual chips,each chip is picked up and bonded on a lead frame (diebonding). The die bonding can be carried out in such away that a heat sensitive adhesive sheet for die bondingis stuck in advance, in a wafer-?processing step.?[0003] A sticking apparatus of the adhesive sheet hasbeen disclosed, for instance, in the patent document 1.The sticking apparatus disclosed in the patent document1 is arranged to include a table that sucks and supportsa wafer in a state that a rear surface side of the wafer ispositioned so as to be an upper face side thereof, a sheetsupplying unit that supplies an adhesive sheet for diebonding to the upper face side of the wafer, and a pressroll that presses the adhesive sheet supplied to the upperface side of the wafer to stick the adhesive sheet to thewafer. Herein a cover sheet (a release liner) is temporarilybonded to one side face of the adhesive sheet, and afterthe adhesive sheet is stuck on the wafer, the release lineris peeled off.?[0004] ?[Patent document 1] Japanese Patent Applica-tion Laid-?open No. 2003-257898DISCLOSURE OF THE INVENTIONPROBLEMS TO BE SOLVED BY THE INVENTION?[0005] Conventionally, since a raw sheet of the adhe-sive sheet has multi-?layered structure with the releaseliner, the release liner is peeled off at a peeling sectionand wound up in a prior stage of the adhesive sheet stick-ing on the rear surface of the wafer. There happenssometimes, however, such a problem that the qualitystandard of some raw sheets do not conform with re-quired product accuracy. For instance, in some cases,temporary adhesive strength between the adhesivesheet and the release liner is not uniform in an extendingdirection of the raw sheet. Accordingly, in the case wheresuch a raw sheet is mixed as the adhesive sheet and therelease liner in a specific area along the extending direc-tion are temporarily bonded to each other more stronglythan in other areas, there is a tendency that a peeling-off is not carried out at °an original peeling-?off position inthe peeling section but delayed peeling-?off is broughtabout and the adhesive sheet is trailed by the releaseliner, resulting in that the adhesive sheet is pulled towardsa winding side of the release liner. In this case, an unin-tended tension force is generated in the adhesive sheetbetween the peeling section and the press roll for press-ing the adhesive sheet to the wafer, which causes theoccurrence of warp deformation or wrinkles on the waferafter sticking operation.?[0006] Moreover, in the case where the adhesive sheetis stuck on the wafer together with the release liner, peel-ing-?off of the release liner in the area having strong tem-porary adhesive strength may cause inclusion of the ad-hesive sheet in winding, if the adhesive sheet is not com-pletely bonded to the wafer.?[0007] Then, as shown in FIG. 8, such an arrangementis considered that a preliminary peeling unit 200 is pro-vided in course of paying out the raw sheet L in whichthe release liner PS is temporarily bonded to the adhesivesheet S, and the release liner PS is peeled off prelimi-narily from the adhesive sheet S before sticking the ad-hesive sheet S on the wafer W.?[0008] With such an arrangement, however, in thecase where the adhesive sheet S is a heat sensitive ad-hesive sheet, there occur the following disadvantages.That is, once the adhesive sheet S is peeled off from therelease liner PS, which blocks temporary re-?bonding, theadhesive sheet S tends to get wrinkled or sagged. Con-sequently, when the adhesive sheet S is bonded to thewafer W, bonding operation is carried out in a state ofinvolving wrinkles and air bubbles therein, which produc-es massive scale of product defects.[OBJECT OF THE INVENTION]?[0009] The present invention has been proposed inview of the above disadvantages. An object of the presentinvention is to provide a sticking apparatus and a stickingmethod that can perform a stable peeling-?off to preventan unnecessary tension force from being applied to theadhesive sheet, even when adhesive strength betweenthe release liner and the adhesive sheet in a raw sheetstate of the adhesive sheet is varied.?[0010] Another object of the present invention is to pro-vide a sticking apparatus and a sticking method, in whichpeeling-?off strength between the release liner and theadhesive sheet can be equalized and thereby sticking ofthe adhesive sheet on the plate-?like member can be per-formed with predetermined tension force by means oftemporary re-?bonding after the preliminary peeling-?off,and thus a press force by the press roll is imparted to theadhesive sheet through the release liner, enabling to stickthe adhesive sheet while precluding the occurrence ofwrinkles or the mixing of air bubbles or the like.MEANS FOR SOLVING THE PROBLEMS?[0011] To achieve the objects, the present invention isarranged so that a sticking apparatus includes a sticking1 2